Source: http://www.engadget.com/2011/09/08/single-chip-dimm-stacks-integrated-circuits-like-shingles-for-gr/
Cellphone screens may be
getting bigger, but the push to shrink all other computing components continues unabated. Invensas is well aware of this, and has come up with new, multi-die memory that promises to be both smaller in size and more capacious than existing
DRAM. Called xFD, it mounts integrated circuits in a "shingle-like configuration" on top of one another to accomplish the trick. Such stacking increases speed while reducing power consumption due to much shorter connections between RAM dies than what's found in
multi-chip DIMM. Of course, the memory won't be popping up in PCs anytime soon, but the company will be showing off its new tech at
IDF next week. While you wait, there's more RAM reading in the PR after the break.
Continue reading Single-chip DIMM stacks integrated circuits like shingles for greater DRAM efficiency
Single-chip DIMM stacks integrated circuits like shingles for greater DRAM efficiency originally appeared on Engadget on Thu, 08 Sep 2011 08:22:00 EDT. Please see our terms for use of feeds.
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